China Hongguang Holdings Limited announced that its indirect wholly-owned unit, Guangdong Longguang New Materials Technology Co., Ltd., has formally completed the enterprise standard filing for the “Manufacturing Process for TGV Glass-Core Copper-Clad Laminates” (Standard No. Q/LG 001-2026) on the national Enterprise Standard Information Public Service Platform.
The standard, published on 1 July 2022 and set to take effect on 1 July 2026, defines product structure, material composition, manufacturing steps and inspection metrics for next-generation glass-core copper-clad laminates (GCCs). Key technical benchmarks include:
• Glass substrate thickness of 30–100 μm (30–50 μm for flexible formats), enabling roll-to-roll production. • Dissipation factor not exceeding 0.0007 at 30 GHz, markedly outperforming mainstream glass substrates (typically >0.002). • Coefficient of thermal expansion capped at 2.3 ppm/°C, aligned with high-end chip-packaging requirements. • Minimum bending radius of 12 mm for flexible GCC, supporting roll-to-roll processing and cutting-waste reduction of about 65%. • Through-glass via (TGV) micro-holes of 25–45 μm with a taper of 72°–78°, formed during moulding and eliminating secondary laser drilling. • Coating peel strength ≥1.2 N/mm with no delamination at 260 °C reflow, meeting high-temperature SMT reliability standards. • Target mass-production yield ≥93%, versus <72% in conventional processes, and an overall cost reduction of roughly 32%.
Process innovations feature a fully electric furnace with platinum overflow continuous strip forming, integrated TGV micro-hole moulding, and a four-layer gradient metal stack (TiCr nano-barrier, thin copper transition, electrolytic copper, OSP protection) to enhance interface reliability under heat and humidity stress.
Market applications span 77 GHz in-vehicle millimetre-wave radar, 6G phased-array antennas, Chiplet/2.5D/3D advanced packaging, and co-packaged optics (CPO). Management views the filing as a milestone that:
• Establishes proprietary intellectual property and process benchmarks, paving the way for future industry or national standards. • Streamlines customer qualification cycles for semiconductor packaging and telecom equipment makers. • Provides a compliance framework to support planned capacity expansion, supply-chain financing and other capital initiatives. • Strengthens the Group’s positioning in high-performance new-materials, consistent with its “New Materials+” strategy.
Risk disclosures stress that the filing does not assure immediate revenue; commercialisation depends on customer certification, capacity scale-up and market adoption. The Group also cites potential risks from technological substitution, ramp-up uncertainties and the pace of downstream sectors such as 6G communications and advanced packaging.
The Board reiterates that this announcement serves to update shareholders and investors on technical progress and does not constitute an invitation to trade the company’s shares.