On September 8, ASML Holding NV rose 3.67% in regular trading, trading at $1,768.97 per share, with turnover of $359 million. The rally was driven by confirmation that both TSMC and Samsung Electronics will adopt ASML's next-generation High Numerical Aperture (High NA) EUV lithography systems, priced at up to $400 million per unit.

Specifically, Samsung plans to deploy the High NA EUV equipment for high-volume DRAM production by 2028, while TSMC intends to begin volume manufacturing using the current 6-inch reticle-based High NA system starting in 2030. With these commitments, all three major chipmakers — Samsung, TSMC, and Intel — are now confirmed customers of ASML's most advanced lithography platform. ASML also stated that its overall EUV equipment capacity will increase by approximately 30% in 2027.

Separately, ASML announced the start of construction on a new industrial campus in Eindhoven, Netherlands, spanning up to 350,000 square meters with capacity for 20,000 workplaces. The company is also collaborating with clients to develop larger 12-inch photomasks for High NA systems, targeting a pilot production line by 2031 and mass production readiness by 2033 to address growing demand for large data center chips.

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