On August 19, with the collaborative backing of Anhui Xingtai Guarantee and China Bond Credit Enhancement, Yingliu Electromechanical successfully issued its second tranche of sci-tech innovation bonds for 2026. The issuance totals RMB 500 million with a three-year term and a coupon rate of 1.93%, marking the nation's first sci-tech innovation bond supported by a risk-sharing instrument tailored for both tech enterprises and private companies. This achievement signifies a major breakthrough in bond financing innovation for technology-driven enterprises within Anhui Province.

The issuance introduced a pioneering credit enhancement model, combining a central bank risk-sharing guarantee with a counter-guarantee from a local guarantee institution. By leveraging the dual backing of central and local entities, it stands as the first centrally-local collaborative credit enhancement project since the integration of risk-sharing tools for tech innovation and private enterprise bonds. This initiative successfully transitions tech firms from sole reliance on traditional bank loans to accessing direct financing avenues through the interbank market.

By refining the financing framework that emphasizes central-local coordination and shared risk, market confidence was significantly fortified while investment risks for financial institutions were mitigated. The bond's issuance rate came in 15 basis points below the market average for the same period, effectively reducing overall financing costs for the company. This, in turn, boosts operational efficiency, sharpens competitive advantages, and elevates recognition within capital markets, fostering a virtuous cycle where finance empowers industry and industry, in turn, strengthens the real economy.

The successful implementation of this pioneering project provides a replicable and scalable model for bond financing by tech-oriented private enterprises across the province. The support system—built on central-local synergy, fiscal-financial collaboration, and shared risk—is poised to facilitate more high-quality private tech firms in issuing sci-tech innovation bonds. This will further expand their direct financing channels, lower financing expenses, and solidify Anhui's position as a leading hub for technological innovation, driving high-quality growth in both the manufacturing sector and the broader innovation economy.