Shenzhen Kaifa Technology to Invest 1.85 Billion Yuan in High-End Memory Chip Expansion; Shares up 4%
MT Newswires Live
Sep 10
Shenzhen Kaifa Technology (SHE:000021) subsidiary Shenzhen Payton will invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity, according to a Thursday filing with the Shenzhen bourse.
The project includes 1.22 billion yuan for a new factory capable of handling 90,000 wafers monthly of traditional packaging and 10,000 wafers monthly of 2.5D advanced packaging as well as 630 million yuan for a 2.5D/3DS advanced packaging research and development line.
Construction is slated for completion by December 2028. Pre-tax investment payback is about 12 years.
Shares of the hard disk components manufacturer rose 4% in recent trade.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.