Samsung Electronics (KRX:005930) has launched an AI chip packaging research center in Yokohama to speed development through collaboration with Japanese back-end manufacturing leaders, Nikkei Asia reported Wednesday.

The 6,600-square-meter Advanced Package Lab includes a clean room replicating actual production conditions and will employ 95 researchers from both countries, the news agency said, citing the company.

The facility, backed by 40 billion yen in investment including 22.5 billion yen in Japanese government subsidies, focuses on advanced packaging materials and mass-production methods, the publication said.

Samsung said the lab will strengthen Korea-Japan tech cooperation and drive next-generation packaging growth, with 15 major local suppliers attending the opening, the report said.

Samsung shares were up over 1% in recent trade.

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